Tool & Die Futures Initiative (TDFI) Kickoff Meeting
Tool & Die Futures Initiative (TDFI) Inaugural Meeting
January 29th, 1-5pm,
Elliott Hall Auditorium (Room 241)
Campus of Oakland University
Rochester, MI
The Tool & Die Futures Initiative (TDFI) is taking shape as a result of several conversations that have occurred in 2009 between T&D industry representatives and customer groups, sponsored by CIBRE (www.cibre-ou.org ), The Center for Integrated Business Research and Education through the School of Business Administration, Oakland University.
The goal is to address the challenges facing the industry and develop strategies to make it competitive. The TDFI formalization is the result of a T&D Industry Futures Dialog, held on Nov 17th at Oakland University. At this meeting over 30 tool & die and related companies expressed a great interest in collaborating on behalf of the tool & die industry.
The first official meeting of the Tool & Die Futures Initiative is to be held on Friday, January 29th 1-5 pm in the Elliott Hall Auditorium (241 Elliott Hall) on Oakland University Campus.
Agenda
i. Introduction to TDFI
ii. Guest Speaker - A lean expert from Large Tier One (Introduction)
iii. How can companies become more efficient through lean thinking? What
are some ways Jeff can help promote lean thinking?
iv. Mr. Mike Vincent, MMTC (Introduction)
v. Lean process training, potential funding opportunities, and experiences of
Tool & die collaborative groups.
vi. Bob Quinn (Introduction)
Discuss strategies on how to structure the group
Help shape the group and chart a course that will positively change the industry. Please email Bob Quinn (bob@rcmtool.com) or call (O: 586-336-1237; C: 586-336-1237). You can also email me if it's convenient and I will pass along to Bob Quinn. Either way, those planning to attend are asked to confirm by Jan 27th
